TSL2569T【PDF 34/37 页】IC LIGHT TO DGTL CONV 6-TMB

TSL2568, TSL2569

LIGHT-TO-DIGITAL CONVERTER

TAOS091D DECEMBER 2008

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

Tooling Required

D Chipscale

Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 ?/SPAN>m)

D TMB

Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 ?/SPAN>m)

Process

1. Apply solder paste using stencil

2. Place component

3. Reflow solder/cure

4. X-Ray verify (recommended for chipscale only)

Additional Notes for Chipscale

Placement of the TSL2568/TSL2569 chipscale device onto the gold immersion substrate is accomplished using

a standard surface mount manufacturing process. Using a 152-糾 stencil with a 0.21 mm square aperture, print

solder paste onto the substrate. Machine-place the TSL2568/TSL2569 from the tape onto the substrate. A

suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with

a diameter of approximately 0.75 mm. The part is picked up from the center of the body.

It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,

or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.

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